| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header, Breakaway |
| Aina ya Mawasiliano | Male Pin |
| Lami - Kuoana | 0.138" (3.50mm) |
| Idadi ya Nafasi | 20 |
| Idadi ya Safu | 2 |
| Nafasi ya Mstari - Kuoana | 0.236" (6.00mm) |
| Idadi ya Nafasi zilizopakiwa | All |
| Mtindo | Board to Cable/Wire |
| Kufunika | Unshrouded |
| Aina ya Kuweka | Through Hole |
| Kukomesha | Solder |
| Aina ya Kufunga | Push-Pull |
| Urefu wa Mawasiliano - Kuoana | 0.633" (16.09mm) |
| Urefu wa Mawasiliano - Chapisha | 0.120" (3.05mm) |
| Urefu wa Mawasiliano ya Jumla | 0.931" (23.64mm) |
| Urefu wa Insulation | 0.177" (4.50mm) |
| Wasiliana na Sura | Square |
| Wasiliana Kumaliza - Kuchumbiana | Gold |
| Wasiliana Kumaliza Unene - Kupandana | 30.0µin (0.76µm) |
| Wasiliana kumaliza - Tuma | Tin |
| Nyenzo ya Mawasiliano | Cartridge Brass |
| Nyenzo ya kuhami | Liquid Crystal Polymer (LCP), Glass Filled |
| Vipengele | - |
| Joto la Uendeshaji | - |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | UL94 V-0 |
| Rangi ya Insulation | Black |
| Ukadiriaji wa sasa | - |
| Ukadiriaji wa Voltage | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
