Andika: Solder Paste, Muundo: Sn63Pb37 (63/37), Kiwango cha kuyeyuka: 361°F (183°C), Aina ya Flux: Water Soluble,
Andika: Solder Paste, Two Part Mix, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kiwango cha kuyeyuka: 423 ~ 428°F (217 ~ 220°C), Aina ya Flux: No-Clean,
Andika: Solder Paste, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kiwango cha kuyeyuka: 423 ~ 428°F (217 ~ 220°C), Aina ya Flux: No-Clean,
Andika: Solder Paste, Muundo: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Kiwango cha kuyeyuka: 281°F (138°C), Aina ya Flux: No-Clean,
Andika: Wire Solder, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kipenyo: 0.020" (0.51mm), Kiwango cha kuyeyuka: 423 ~ 428°F (217 ~ 220°C), Aina ya Flux: No-Clean, Water Soluble, Kupima waya: 24 AWG, 25 SWG,
Andika: Solder Sphere, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kipenyo: 0.014" (0.36mm), Kiwango cha kuyeyuka: 423 ~ 428°F (217 ~ 220°C),
Andika: Solder Paste, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kiwango cha kuyeyuka: 423 ~ 428°F (217 ~ 220°C), Aina ya Flux: Water Soluble,
Andika: Wire Solder, Muundo: Sn99.3Cu0.7 (99.3/0.7), Kipenyo: 0.020" (0.51mm), Kiwango cha kuyeyuka: 441°F (227°C), Aina ya Flux: No-Clean, Water Soluble,
Andika: Solder Paste, Muundo: Sn96.5Ag3.5 (96.5/3.5), Kiwango cha kuyeyuka: 430°F (221°C), Aina ya Flux: Water Soluble,
Andika: Solder Sphere, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kipenyo: 0.012" (0.31mm), Kiwango cha kuyeyuka: 423 ~ 428°F (217 ~ 220°C),
Andika: Wire Solder, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kipenyo: 0.031" (0.79mm), Kiwango cha kuyeyuka: 423 ~ 428°F (217 ~ 220°C), Aina ya Flux: No-Clean, Water Soluble, Kupima waya: 20 AWG, 22 SWG,
Andika: Solder Paste, Muundo: Sn63Pb37 (63/37), Kiwango cha kuyeyuka: 361°F (183°C), Aina ya Flux: No-Clean,
Andika: Wire Solder, Muundo: Sn63Pb37 (63/37), Kipenyo: 0.040" (1.02mm), Kiwango cha kuyeyuka: 361°F (183°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 18 AWG, 19 SWG,