Andika: Epoxy, Vipengele: Heat Cure, Kwa Matumizi na / Bidhaa Zinazohusiana: Underfill Electronic Components,
Andika: Silicone, Vipengele: Non-Corrosive, Kwa Matumizi na / Bidhaa Zinazohusiana: Sealing Electronic Components,
Andika: Potting Compound, 1 Part, Vipengele: Non-Corrosive, Kwa Matumizi na / Bidhaa Zinazohusiana: Potting,
Andika: Epoxy, Vipengele: Heat Cure, Kwa Matumizi na / Bidhaa Zinazohusiana: SMD Components to PCB,
Andika: Silicone, Vipengele: Clear, 300mL, Kwa Matumizi na / Bidhaa Zinazohusiana: Multi-Purpose,
Andika: Epoxy, Vipengele: Heat Cure, Kwa Matumizi na / Bidhaa Zinazohusiana: Multi-Purpose,
Andika: Epoxy, 2 Part, Vipengele: Conductive, Kwa Matumizi na / Bidhaa Zinazohusiana: Steel, Aluminum, Plastic, Rubber, Glass,
Andika: Potting Compound, 2 Part, Vipengele: Flame Retardant, Kwa Matumizi na / Bidhaa Zinazohusiana: Sealing Electronic Components,