Sehemu ya hisa.: 5605
Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 50 (2 x 25), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin-Lead, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,