Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 42 (2 x 21), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,
Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 52 (2 x 26), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,
Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,
Andika: DIP, 0.4" (10.16mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,
Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,
Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 40 (2 x 20), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,
Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 22 (2 x 11), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,
Andika: DIP, 0.4" (10.16mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 22 (2 x 11), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,
Andika: DIP, 0.2" (5.08mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 10 (2 x 5), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,
Andika: LGA, Idadi ya Vyeo au Pini (Gridi): 1366 (32 x 41), Lami - Kuoana: 0.040" (1.02mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Copper Alloy,
Andika: Transistor, TO-220, Idadi ya Vyeo au Pini (Gridi): 3 (Rectangular), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Nyenzo ya Mawasiliano - Kuchumbiana: Brass,