Kifurushi kilichopozwa: BGA, Njia ya Kiambatisho: Clip, Sura: Cylindrical,
Andika: Top Mount, Extrusion, Kifurushi kilichopozwa: Power Modules, Njia ya Kiambatisho: Adhesive, Sura: Rectangular, Fins, Urefu: 12.000" (304.80mm), Upana: 11.000" (279.40mm),
Andika: Top Mount, Extrusion, Kifurushi kilichopozwa: Power Modules, Njia ya Kiambatisho: Adhesive, Sura: Rectangular, Fins, Urefu: 12.320" (312.93mm), Upana: 3.420" (86.87mm),
Andika: Board Level, Kifurushi kilichopozwa: TO-5, Njia ya Kiambatisho: Press Fit, Sura: Cylindrical, Urefu: 0.400" (10.16mm), Upana: 0.315" (8.00mm) ID,