Andika: Wire Solder, Muundo: Sn60Pb40 (60/40), Kipenyo: 0.040" (1.02mm), Kiwango cha kuyeyuka: 361 ~ 374°F (183 ~ 190°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 18 AWG, 19 SWG,
Andika: Wire Solder, Muundo: Sn60Pb40 (60/40), Kipenyo: 0.025" (0.64mm), Kiwango cha kuyeyuka: 361 ~ 374°F (183 ~ 190°C), Aina ya Flux: No-Clean, Kupima waya: 22 AWG, 23 SWG,
Andika: Wire Solder, Muundo: Sn60Pb40 (60/40), Kipenyo: 0.031" (0.79mm), Kiwango cha kuyeyuka: 361 ~ 374°F (183 ~ 190°C), Aina ya Flux: No-Clean, Kupima waya: 20 AWG, 22 SWG,
Andika: Wire Solder, Muundo: Sn60Pb40 (60/40), Kipenyo: 0.025" (0.64mm), Kiwango cha kuyeyuka: 361 ~ 374°F (183 ~ 190°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 22 AWG, 23 SWG,
Andika: Wire Solder, Muundo: Sn99.3Cu0.7 (99.3/0.7), Kipenyo: 0.015" (0.38mm), Kiwango cha kuyeyuka: 441°F (227°C), Aina ya Flux: No-Clean, Kupima waya: 27 AWG, 28 SWG,
Andika: Wire Solder, Muundo: Sn60Pb40 (60/40), Kipenyo: 0.031" (0.79mm), Kiwango cha kuyeyuka: 361 ~ 374°F (183 ~ 190°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 20 AWG, 22 SWG,
Andika: Wire Solder, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kipenyo: 0.020" (0.51mm), Kiwango cha kuyeyuka: 423 ~ 424°F (217 ~ 218°C), Aina ya Flux: No-Clean, Kupima waya: 24 AWG, 25 SWG,
Andika: Wire Solder, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kipenyo: 0.020" (0.51mm), Kiwango cha kuyeyuka: 423 ~ 424°F (217 ~ 218°C), Aina ya Flux: Water Soluble, Kupima waya: 24 AWG, 25 SWG,
Andika: Wire Solder, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kipenyo: 0.015" (0.38mm), Kiwango cha kuyeyuka: 423 ~ 424°F (217 ~ 218°C), Aina ya Flux: No-Clean, Kupima waya: 27 AWG, 28 SWG,
Andika: Wire Solder, Muundo: Sn95.8Ag3.5Cu0.7 (95.8/3.5/0.7), Kipenyo: 0.015" (0.38mm), Aina ya Flux: No-Clean, Kupima waya: 27 AWG, 28 SWG,
Andika: Wire Solder, Muundo: Sn99.3Cu0.7 (99.3/0.7), Kipenyo: 0.020" (0.51mm), Kiwango cha kuyeyuka: 441°F (227°C), Aina ya Flux: No-Clean, Kupima waya: 24 AWG, 25 SWG,
Andika: Wire Solder, Muundo: Sn95.8Ag3.5Cu0.7 (95.8/3.5/0.7), Kipenyo: 0.020" (0.51mm), Aina ya Flux: Water Soluble, Kupima waya: 24 AWG, 25 SWG,
Andika: Wire Solder, Muundo: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Kipenyo: 0.025" (0.64mm), Kiwango cha kuyeyuka: 423°F (217°C), Aina ya Flux: No-Clean, Kupima waya: 22 AWG, 23 SWG,
Andika: Wire Solder, Muundo: Sn95.8Ag3.5Cu0.7 (95.8/3.5/0.7), Kipenyo: 0.015" (0.38mm), Kiwango cha kuyeyuka: 423 ~ 424°F (217 ~ 218°C), Aina ya Flux: No-Clean, Kupima waya: 27 AWG, 28 SWG,
Andika: Wire Solder, Muundo: Sn63Pb37 (63/37), Kipenyo: 0.015" (0.38mm), Kiwango cha kuyeyuka: 361°F (183°C), Aina ya Flux: No-Clean, Kupima waya: 27 AWG, 28 SWG,
Andika: Wire Solder, Muundo: Sn60Pb40 (60/40), Kipenyo: 0.015" (0.38mm), Kiwango cha kuyeyuka: 361 ~ 374°F (183 ~ 190°C), Aina ya Flux: No-Clean, Kupima waya: 27 AWG, 28 SWG,
Andika: Wire Solder, Muundo: Sn63Pb37 (63/37), Kipenyo: 0.020" (0.51mm), Kiwango cha kuyeyuka: 361°F (183°C), Aina ya Flux: No-Clean, Kupima waya: 24 AWG, 25 SWG,
Andika: Wire Solder, Muundo: Sn63Pb37 (63/37), Kipenyo: 0.015" (0.38mm), Kiwango cha kuyeyuka: 361°F (183°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 27 AWG, 28 SWG,
Andika: Wire Solder, Muundo: Sn60Pb40 (60/40), Kipenyo: 0.015" (0.38mm), Kiwango cha kuyeyuka: 361 ~ 374°F (183 ~ 190°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 27 AWG, 28 SWG,
Andika: Wire Solder, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kipenyo: 0.010" (0.25mm), Kiwango cha kuyeyuka: 423 ~ 424°F (217 ~ 218°C), Aina ya Flux: No-Clean, Kupima waya: 30 AWG, 33 SWG,
