Aina ya Bodi ya Proto: SMD to Plated Through Hole Board, Kifurushi Kimekubaliwa: TSSOP, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16",
Aina ya Bodi ya Proto: SMD to Plated Through Hole Board, Kifurushi Kimekubaliwa: TSSOP,
Aina ya Bodi ya Proto: SMD to Plated Through Hole Board, Kifurushi Kimekubaliwa: SOIC, Unene wa Bodi: 0.062" (1.57mm) 1/16",
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: PSOP, SSOP, TSOP, Unene wa Bodi: 0.062" (1.57mm) 1/16",
Aina ya Bodi ya Proto: SMD to Plated Through Hole Board, Kifurushi Kimekubaliwa: QFP, Unene wa Bodi: 0.062" (1.57mm) 1/16",
Aina ya Bodi ya Proto: SMD to Plated Through Hole Board, Kifurushi Kimekubaliwa: PLCC, Unene wa Bodi: 0.062" (1.57mm) 1/16",
Aina ya Bodi ya Proto: SMD to Plated Through Hole Board, Kifurushi Kimekubaliwa: TQFP,
Aina ya Bodi ya Proto: SMD to Plated Through Hole Board, Kifurushi Kimekubaliwa: SOIC,
Aina ya Bodi ya Proto: SMD to Plated Through Hole Board, Kifurushi Kimekubaliwa: SOIC, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16",
