Soketi za IC, Transistors | Viunganishi, Viunganishi | 100

209-PGM17020-10H

Sehemu ya hisa.: 1693

Andika: PGA, Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

20-PLS13120-12

Sehemu ya hisa.: 1754

Andika: PGA, ZIF (ZIP), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

20-PRS13120-12

Sehemu ya hisa.: 1811

Andika: PGA, ZIF (ZIP), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-6554-16

Sehemu ya hisa.: 1992

Andika: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-3554-16

Sehemu ya hisa.: 2043

Andika: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

281-PGM18037-11

Sehemu ya hisa.: 2051

Andika: PGA, Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

24-6554-16

Sehemu ya hisa.: 2250

Andika: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-6553-16

Sehemu ya hisa.: 2231

Andika: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Nickel,

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Aries Electronics

28-3553-16

Sehemu ya hisa.: 2279

Andika: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-3551-16

Sehemu ya hisa.: 2211

Andika: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-6551-16

Sehemu ya hisa.: 2207

Andika: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-6552-16

Sehemu ya hisa.: 2240

Andika: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

232-PGM17037-11

Sehemu ya hisa.: 2305

Andika: PGA, Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

24-3554-16

Sehemu ya hisa.: 2290

Andika: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

225-PGM15001-11

Sehemu ya hisa.: 2272

Andika: PGA, Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

224-PGM15038-11H

Sehemu ya hisa.: 2330

Andika: PGA, Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

24-6551-16

Sehemu ya hisa.: 2434

Andika: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

24-3551-16

Sehemu ya hisa.: 2411

Andika: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

24-6553-16

Sehemu ya hisa.: 2427

Andika: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

24-3553-16

Sehemu ya hisa.: 2437

Andika: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

24-3552-16

Sehemu ya hisa.: 2444

Andika: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

24-6552-16

Sehemu ya hisa.: 2452

Andika: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

209-PGM17030-11

Sehemu ya hisa.: 2460

Andika: PGA, Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

209-PGM17046-11

Sehemu ya hisa.: 2468

Andika: PGA, Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-6556-41

Sehemu ya hisa.: 2489

Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-6556-40

Sehemu ya hisa.: 2704

Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-3575-16

Sehemu ya hisa.: 2754

Andika: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-6575-16

Sehemu ya hisa.: 2769

Andika: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-3572-16

Sehemu ya hisa.: 2802

Andika: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Nickel,

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Aries Electronics

28-3570-16

Sehemu ya hisa.: 2836

Andika: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Nickel,

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Aries Electronics

28-6572-16

Sehemu ya hisa.: 2825

Andika: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-3573-16

Sehemu ya hisa.: 2840

Andika: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Nickel,

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Aries Electronics

28-6570-16

Sehemu ya hisa.: 2850

Andika: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Nickel Boron, Wasiliana Kumaliza Unene - Kupandana: 50.0µin (1.27µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Nickel,

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Aries Electronics

28-3574-16

Sehemu ya hisa.: 2772

Andika: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-6574-16

Sehemu ya hisa.: 2774

Andika: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Aries Electronics

28-6573-16

Sehemu ya hisa.: 2768

Andika: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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