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TVS - Teknolojia Mchanganyiko

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  • TVS - Teknolojia Mchanganyiko
1810-28-A3
Bourns Inc.

1810-28-A3

Sehemu ya hisa.: 1099

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: General Purpose, Aina ya Kuweka: DIN Rail, Kifurushi / Kesi: Module,

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1669-02
Bourns Inc.

1669-02

Sehemu ya hisa.: 861

Voltage - Kufunga: 36V, Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: General Purpose, Aina ya Kuweka: In Line, Kifurushi / Kesi: Cartridge,

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1810-15-A3
Bourns Inc.

1810-15-A3

Sehemu ya hisa.: 1039

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: General Purpose, Aina ya Kuweka: DIN Rail, Kifurushi / Kesi: Module,

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1840-24-A1
Bourns Inc.

1840-24-A1

Sehemu ya hisa.: 619

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: General Purpose, Aina ya Kuweka: DIN Rail, Kifurushi / Kesi: Module,

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1840-05-A1
Bourns Inc.

1840-05-A1

Sehemu ya hisa.: 551

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: General Purpose, Aina ya Kuweka: DIN Rail, Kifurushi / Kesi: Module,

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1840-12-A1
Bourns Inc.

1840-12-A1

Sehemu ya hisa.: 608

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: General Purpose, Aina ya Kuweka: DIN Rail, Kifurushi / Kesi: Module,

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1669-01
Bourns Inc.

1669-01

Sehemu ya hisa.: 914

Voltage - Kufunga: 36V, Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: General Purpose, Aina ya Kuweka: In Line, Kifurushi / Kesi: Cartridge,

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1840-12-A3
Bourns Inc.

1840-12-A3

Sehemu ya hisa.: 614

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: General Purpose, Aina ya Kuweka: DIN Rail, Kifurushi / Kesi: Module,

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1840-24-A3
Bourns Inc.

1840-24-A3

Sehemu ya hisa.: 509

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: General Purpose, Aina ya Kuweka: DIN Rail, Kifurushi / Kesi: Module,

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1840-05-A3
Bourns Inc.

1840-05-A3

Sehemu ya hisa.: 554

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: General Purpose, Aina ya Kuweka: DIN Rail, Kifurushi / Kesi: Module,

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1669-06
Bourns Inc.

1669-06

Sehemu ya hisa.: 749

Voltage - Kufunga: 36V, Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: General Purpose, Aina ya Kuweka: In Line, Kifurushi / Kesi: Cartridge,

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2410-33-G-MSP-S
Bourns Inc.

2410-33-G-MSP-S

Sehemu ya hisa.: 12022

Voltage - Kufunga: 350V, Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: Telecommunications, Aina ya Kuweka: Through Hole, Kifurushi / Kesi: Radial - 5 Leads,

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2410-31-G-MSP
Bourns Inc.

2410-31-G-MSP

Sehemu ya hisa.: 13051

Voltage - Kufunga: 350V, Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: Telecommunications, Aina ya Kuweka: Through Hole, Kifurushi / Kesi: Radial - 5 Leads,

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2377-45-HS
Bourns Inc.

2377-45-HS

Sehemu ya hisa.: 9223

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: General Purpose, Aina ya Kuweka: Panel Mount, Kifurushi / Kesi: Module, Duty Station,

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4B06B-540-090/260
Bourns Inc.

4B06B-540-090/260

Sehemu ya hisa.: 19162

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: Telecommunications, Aina ya Kuweka: Through Hole, Kifurushi / Kesi: 13-SIP Module, 6 Leads,

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4B06B-540-125/219
Bourns Inc.

4B06B-540-125/219

Sehemu ya hisa.: 19139

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: Telecommunications, Aina ya Kuweka: Through Hole, Kifurushi / Kesi: 13-SIP Module, 6 Leads,

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4B06B-540-095/095
Bourns Inc.

4B06B-540-095/095

Sehemu ya hisa.: 19120

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: Telecommunications, Aina ya Kuweka: Through Hole, Kifurushi / Kesi: 13-SIP Module, 6 Leads,

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4B06B-540-290/290
Bourns Inc.

4B06B-540-290/290

Sehemu ya hisa.: 19084

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: Telecommunications, Aina ya Kuweka: Through Hole, Kifurushi / Kesi: 13-SIP Module, 6 Leads,

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TISP8201HDMR-S
Bourns Inc.

TISP8201HDMR-S

Sehemu ya hisa.: 49815

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 2, Maombi: General Purpose, Aina ya Kuweka: Surface Mount, Kifurushi / Kesi: 8-SOIC (0.154", 3.90mm Width),

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TISP6NTP2ADR
Bourns Inc.

TISP6NTP2ADR

Sehemu ya hisa.: 5390

Voltage - Kufunga: -70V, Teknolojia: Mixed Technology, Idadi ya Mizunguko: 4, Maombi: SLIC, Aina ya Kuweka: Surface Mount, Kifurushi / Kesi: 8-SOIC (0.154", 3.90mm Width),

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TISP8210MDR-S
Bourns Inc.

TISP8210MDR-S

Sehemu ya hisa.: 127610

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: SLIC, Aina ya Kuweka: Surface Mount, Kifurushi / Kesi: 8-SOIC (0.154", 3.90mm Width),

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TISP9110LDMR-S
Bourns Inc.

TISP9110LDMR-S

Sehemu ya hisa.: 110793

Voltage - Kufunga: 15V, Teknolojia: Mixed Technology, Idadi ya Mizunguko: 2, Maombi: SLIC, Aina ya Kuweka: Surface Mount, Kifurushi / Kesi: 8-SOIC (0.154", 3.90mm Width),

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FVC3100-BK
Bourns Inc.

FVC3100-BK

Sehemu ya hisa.: 3436

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: Telecommunications, Aina ya Kuweka: Surface Mount,

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TISP9110MDMR-S
Bourns Inc.

TISP9110MDMR-S

Sehemu ya hisa.: 80561

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 2, Maombi: General Purpose, Aina ya Kuweka: Surface Mount, Kifurushi / Kesi: 8-SOIC (0.154", 3.90mm Width),

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TISP8200HDMR-S
Bourns Inc.

TISP8200HDMR-S

Sehemu ya hisa.: 49854

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 2, Maombi: General Purpose, Aina ya Kuweka: Surface Mount, Kifurushi / Kesi: 8-SOIC (0.154", 3.90mm Width),

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TISP6NTP2ADR-S
Bourns Inc.

TISP6NTP2ADR-S

Sehemu ya hisa.: 3412

Voltage - Kufunga: -70V, Teknolojia: Mixed Technology, Idadi ya Mizunguko: 4, Maombi: SLIC, Aina ya Kuweka: Surface Mount, Kifurushi / Kesi: 8-SOIC (0.154", 3.90mm Width),

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TISP61089HDMR-S
Bourns Inc.

TISP61089HDMR-S

Sehemu ya hisa.: 50136

Voltage - Kufunga: -57V, Teknolojia: Mixed Technology, Idadi ya Mizunguko: 2, Maombi: SLIC, Aina ya Kuweka: Surface Mount, Kifurushi / Kesi: 8-SOIC (0.154", 3.90mm Width),

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FVC2300-BK
Bourns Inc.

FVC2300-BK

Sehemu ya hisa.: 3431

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: Telecommunications, Aina ya Kuweka: Surface Mount,

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TISP8211MDR-S
Bourns Inc.

TISP8211MDR-S

Sehemu ya hisa.: 127578

Teknolojia: Mixed Technology, Idadi ya Mizunguko: 1, Maombi: SLIC, Aina ya Kuweka: Surface Mount, Kifurushi / Kesi: 8-SOIC (0.154", 3.90mm Width),

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TISP6NTP2CDR-S
Bourns Inc.

TISP6NTP2CDR-S

Sehemu ya hisa.: 113247

Voltage - Kufunga: -112V, Teknolojia: Mixed Technology, Idadi ya Mizunguko: 4, Maombi: SLIC, Aina ya Kuweka: Surface Mount, Kifurushi / Kesi: 8-SOIC (0.154", 3.90mm Width),

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