| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header |
| Aina ya Mawasiliano | Male Pin |
| Lami - Kuoana | 0.100" (2.54mm) |
| Idadi ya Nafasi | 8 |
| Idadi ya Safu | 2 |
| Nafasi ya Mstari - Kuoana | 0.100" (2.54mm) |
| Idadi ya Nafasi zilizopakiwa | All |
| Mtindo | Board to Cable/Wire |
| Kufunika | Shrouded - 4 Wall |
| Aina ya Kuweka | Through Hole |
| Kukomesha | Solder |
| Aina ya Kufunga | Latch Holder |
| Urefu wa Mawasiliano - Kuoana | 0.311" (7.90mm) |
| Urefu wa Mawasiliano - Chapisha | 0.145" (3.68mm) |
| Urefu wa Mawasiliano ya Jumla | 0.692" (17.58mm) |
| Urefu wa Insulation | 0.854" (21.69mm) |
| Wasiliana na Sura | Square |
| Wasiliana Kumaliza - Kuchumbiana | Tin |
| Wasiliana Kumaliza Unene - Kupandana | - |
| Wasiliana kumaliza - Tuma | Tin |
| Nyenzo ya Mawasiliano | Copper Alloy |
| Nyenzo ya kuhami | Syndiotactic Polystyrene (SPS), Glass Filled |
| Vipengele | Board Guide |
| Joto la Uendeshaji | - |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | - |
| Rangi ya Insulation | Natural |
| Ukadiriaji wa sasa | - |
| Ukadiriaji wa Voltage | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
