Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Aina ya Kiunganishi | Header |
Aina ya Mawasiliano | Male Blade; Male Pin |
Lami - Kuoana | - |
Idadi ya Nafasi | 10 (6 + 4 Power) |
Idadi ya Safu | 2 |
Nafasi ya Mstari - Kuoana | 0.248" (6.30mm) |
Idadi ya Nafasi zilizopakiwa | All |
Mtindo | Board to Cable/Wire |
Kufunika | Shrouded - 4 Wall |
Aina ya Kuweka | Through Hole |
Kukomesha | Solder |
Aina ya Kufunga | Latch Holder |
Urefu wa Mawasiliano - Kuoana | - |
Urefu wa Mawasiliano - Chapisha | 0.117" (2.97mm) |
Urefu wa Mawasiliano ya Jumla | - |
Urefu wa Insulation | 1.104" (28.04mm) |
Wasiliana na Sura | Rectangular, Square |
Wasiliana Kumaliza - Kuchumbiana | Tin |
Wasiliana Kumaliza Unene - Kupandana | - |
Wasiliana kumaliza - Tuma | Tin |
Nyenzo ya Mawasiliano | Copper Alloy |
Nyenzo ya kuhami | Syndiotactic Polystyrene (SPS), Glass Filled |
Vipengele | Board Guide, Solder Retention |
Joto la Uendeshaji | -40°C ~ 100°C |
Ulinzi wa Ingress | - |
Ukadiriaji wa kuwaka kwa nyenzo | - |
Rangi ya Insulation | Gray |
Ukadiriaji wa sasa | - |
Ukadiriaji wa Voltage | 500V |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |