| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Mtindo wa Kiunganishi | Receptacle |
| Aina ya Kiunganishi | SAS |
| Idadi ya Nafasi | 29 |
| Aina ya Kuweka | Surface Mount, Through Hole |
| Kukomesha | Solder |
| Vipengele | Board Guide, Mating Guide |
| Wasiliana kumaliza | Gold |
| Wasiliana Kumaliza Unene | 30.0µin (0.76µm) |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
