| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kituo | Through Board, Locking |
| Kipenyo cha Shimo | 0.173" (4.39mm) |
| Kipenyo cha Insulation | - |
| Urefu - Kwa ujumla | 0.803" (20.40mm) |
| Kupima waya | 8 AWG |
| Nyenzo ya Mawasiliano | Copper Alloy |
| Wasiliana kumaliza | Silver |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
