| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header |
| Aina ya Mawasiliano | Male Blade |
| Lami - Kuoana | 0.050" (1.27mm) |
| Idadi ya Nafasi | 18 |
| Idadi ya Safu | 1 |
| Nafasi ya Mstari - Kuoana | - |
| Idadi ya Nafasi zilizopakiwa | All |
| Mtindo | Board to Cable/Wire |
| Kufunika | Shrouded - 2 Wall |
| Aina ya Kuweka | Surface Mount |
| Kukomesha | Solder |
| Aina ya Kufunga | Latch Lock |
| Urefu wa Mawasiliano - Kuoana | 0.083" (2.10mm) |
| Urefu wa Mawasiliano - Chapisha | - |
| Urefu wa Mawasiliano ya Jumla | - |
| Urefu wa Insulation | 0.333" (8.45mm) |
| Wasiliana na Sura | Rectangular |
| Wasiliana Kumaliza - Kuchumbiana | Tin |
| Wasiliana Kumaliza Unene - Kupandana | 118.1µin (3.00µm) |
| Wasiliana kumaliza - Tuma | Tin |
| Nyenzo ya Mawasiliano | Brass |
| Nyenzo ya kuhami | Polyphthalamide (PPA), Glass Filled |
| Vipengele | Board Guide |
| Joto la Uendeshaji | -40°C ~ 105°C |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | UL94 HB |
| Rangi ya Insulation | Black |
| Ukadiriaji wa sasa | 1.2A |
| Ukadiriaji wa Voltage | 250V |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
