| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Mtindo wa Kiunganishi | D-Sub, High Density |
| Aina ya Kiunganishi | Plug, Male Pins |
| Idadi ya Nafasi | 62 |
| Idadi ya Safu | 3 |
| Ukubwa wa Shell, Mpangilio wa Kontakt | 4 (DC, C) High Density |
| Aina ya Mawasiliano | Signal |
| Aina ya Kuweka | Through Hole |
| Makala ya Flange | Board Side (4-40) |
| Kukomesha | Solder |
| Vipengele | Board Lock, Grounding Indents |
| Nyenzo ya Shell, Maliza | Steel, Nickel Plated |
| Wasiliana kumaliza | Gold or Gold-Palladium |
| Wasiliana Kumaliza Unene | 30.0µin (0.76µm) |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | UL94 V-0 |
| Ukadiriaji wa sasa | 2A |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
