| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header |
| Aina ya Mawasiliano | Tab |
| Lami - Kuoana | 0.200" (5.08mm) |
| Idadi ya Nafasi | 6 |
| Idadi ya Safu | 2 |
| Nafasi ya Mstari - Kuoana | 0.300" (7.62mm) |
| Idadi ya Nafasi zilizopakiwa | All |
| Mtindo | Board to Board or Cable |
| Kufunika | Shrouded - 4 Wall |
| Aina ya Kuweka | Through Hole |
| Kukomesha | Solder |
| Aina ya Kufunga | Detent Lock |
| Urefu wa Mawasiliano - Kuoana | - |
| Urefu wa Mawasiliano - Chapisha | 0.150" (3.81mm) |
| Urefu wa Mawasiliano ya Jumla | - |
| Urefu wa Insulation | 0.850" (21.59mm) |
| Wasiliana na Sura | Rectangular |
| Wasiliana Kumaliza - Kuchumbiana | Gold |
| Wasiliana Kumaliza Unene - Kupandana | 30.0µin (0.76µm) |
| Wasiliana kumaliza - Tuma | Tin |
| Nyenzo ya Mawasiliano | Copper Alloy |
| Nyenzo ya kuhami | Thermoplastic, Polyester, Glass Filled |
| Vipengele | Board Lock |
| Joto la Uendeshaji | -55°C ~ 105°C |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | UL94 V-0 |
| Rangi ya Insulation | Black |
| Ukadiriaji wa sasa | - |
| Ukadiriaji wa Voltage | 600V |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
