| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header |
| Aina ya Mawasiliano | Male Blade |
| Lami - Kuoana | 0.100" (2.54mm) |
| Idadi ya Nafasi | 41 |
| Idadi ya Safu | 2 |
| Nafasi ya Mstari - Kuoana | 0.125" (3.18mm) |
| Idadi ya Nafasi zilizopakiwa | All |
| Mtindo | Board to Board or Cable |
| Kufunika | Unshrouded |
| Aina ya Kuweka | Through Hole, Right Angle |
| Kukomesha | Solder |
| Aina ya Kufunga | - |
| Urefu wa Mawasiliano - Kuoana | - |
| Urefu wa Mawasiliano - Chapisha | 0.152" (3.86mm) |
| Urefu wa Mawasiliano ya Jumla | - |
| Urefu wa Insulation | 0.415" (10.54mm) |
| Wasiliana na Sura | Rectangular |
| Wasiliana Kumaliza - Kuchumbiana | Gold |
| Wasiliana Kumaliza Unene - Kupandana | 50.0µin (1.27µm) |
| Wasiliana kumaliza - Tuma | - |
| Nyenzo ya Mawasiliano | Gilding Metal |
| Nyenzo ya kuhami | Diallyl Phthalate (DAP), Glass Filled |
| Vipengele | Mating Guide, Mounting Flange |
| Joto la Uendeshaji | -65°C ~ 125°C |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | - |
| Rangi ya Insulation | Green |
| Ukadiriaji wa sasa | 5A |
| Ukadiriaji wa Voltage | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
