| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Badilisha kutoka (Adapter End) | SOIC |
| Badilisha hadi (Mwisho wa Adapter) | DIP, 0.3" (7.62mm) Row Spacing |
| Idadi ya Pini | 10 |
| Lami - Kuoana | 0.050" (1.27mm) |
| Wasiliana Kumaliza - Kuchumbiana | Tin |
| Aina ya Kuweka | Through Hole |
| Kukomesha | Solder |
| Panda - Chapisha | 0.100" (2.54mm) |
| Wasiliana kumaliza - Tuma | Tin-Lead |
| Nyenzo ya Nyumba | - |
| Nyenzo za Bodi | Polyimide (PI) |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
