| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Mtindo | Board to Cable/Wire |
| Aina ya Kiunganishi | Contact, IDC |
| Idadi ya Nafasi | 1 |
| Aina ya Kuweka | Surface Mount |
| Kukomesha | Solder |
| Panda | - |
| Kupima waya | 20-30 AWG |
| Vipengele | - |
| Wasiliana kumaliza | Tin |
| Nyenzo ya Mawasiliano | Copper Alloy |
| Aina ya Kufunga | - |
| Rangi ya Makazi | - |
| Nyenzo ya Nyumba | - |
| Joto la Uendeshaji | -40°C ~ 125°C |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
