| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header |
| Aina ya Mawasiliano | Male Pin |
| Lami - Kuoana | 0.156" (3.96mm) |
| Idadi ya Nafasi | 6 |
| Idadi ya Safu | 1 |
| Nafasi ya Mstari - Kuoana | - |
| Idadi ya Nafasi zilizopakiwa | All |
| Mtindo | Board to Board or Cable |
| Kufunika | Unshrouded |
| Aina ya Kuweka | Through Hole |
| Kukomesha | Solder |
| Aina ya Kufunga | Push-Pull |
| Urefu wa Mawasiliano - Kuoana | 1.310" (33.27mm) |
| Urefu wa Mawasiliano - Chapisha | 0.125" (3.18mm) |
| Urefu wa Mawasiliano ya Jumla | 1.560" (39.62mm) |
| Urefu wa Insulation | 0.125" (3.18mm) |
| Wasiliana na Sura | Square |
| Wasiliana Kumaliza - Kuchumbiana | Gold |
| Wasiliana Kumaliza Unene - Kupandana | 15.0µin (0.38µm) |
| Wasiliana kumaliza - Tuma | Gold |
| Nyenzo ya Mawasiliano | Brass |
| Nyenzo ya kuhami | Thermoplastic |
| Vipengele | - |
| Joto la Uendeshaji | -65°C ~ 105°C |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | UL94 V-2 |
| Rangi ya Insulation | Black |
| Ukadiriaji wa sasa | 5A per Contact |
| Ukadiriaji wa Voltage | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
