| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Mtindo | Board to Cable/Wire |
| Aina ya Kiunganishi | Receptacle, Poke-In Wire |
| Idadi ya Nafasi | 1 |
| Aina ya Kuweka | Board Cutout, Surface Mount, Right Angle, Bottom Entry |
| Kukomesha | Solder |
| Panda | - |
| Aina ya Kufunga | - |
| Vipengele | - |
| Rangi ya Makazi | Natural |
| Kupima waya | 18-24 AWG |
| Nyenzo ya Mawasiliano | Copper Alloy |
| Wasiliana kumaliza | Tin |
| Nyenzo ya Nyumba | Liquid Crystal Polymer (LCP), Glass Filled, Halogen Free |
| Joto la Uendeshaji | -60°C ~ 130°C |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
