| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header |
| Aina ya Mawasiliano | Male Pin |
| Lami - Kuoana | 0.098" (2.50mm) |
| Idadi ya Nafasi | 2 |
| Idadi ya Safu | 1 |
| Nafasi ya Mstari - Kuoana | - |
| Idadi ya Nafasi zilizopakiwa | All |
| Mtindo | Board to Cable/Wire |
| Kufunika | Shrouded - 4 Wall |
| Aina ya Kuweka | Through Hole |
| Kukomesha | Solder |
| Aina ya Kufunga | Latch Lock |
| Urefu wa Mawasiliano - Kuoana | - |
| Urefu wa Mawasiliano - Chapisha | 0.126" (3.20mm) |
| Urefu wa Mawasiliano ya Jumla | - |
| Urefu wa Insulation | 0.356" (9.05mm) |
| Wasiliana na Sura | Square |
| Wasiliana Kumaliza - Kuchumbiana | Gold |
| Wasiliana Kumaliza Unene - Kupandana | 15.0µin (0.38µm) |
| Wasiliana kumaliza - Tuma | Tin |
| Nyenzo ya Mawasiliano | Brass |
| Nyenzo ya kuhami | Liquid Crystal Polymer (LCP) |
| Vipengele | Board Guide, Board Lock |
| Joto la Uendeshaji | -40°C ~ 105°C |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | - |
| Rangi ya Insulation | Black |
| Ukadiriaji wa sasa | - |
| Ukadiriaji wa Voltage | 250V |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
