| Andika | Maelezo. |
| Hali ya Sehemu | Not For New Designs |
|---|---|
| Andika | Solder Paste |
| Muundo | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Kipenyo | - |
| Kiwango cha kuyeyuka | 423°F (217°C) |
| Aina ya Flux | Water Soluble |
| Kupima waya | - |
| Mchakato | Lead Free |
| Fomu | Jar, 17.64 oz (500g) |
| Maisha ya rafu | 6 Months |
| Anza maisha ya rafu | Date of Manufacture |
| Uhifadhi / Jokofu Joto | 35.6°F ~ 46.4°F (2°C ~ 8°C) |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
