| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header, Breakaway |
| Aina ya Mawasiliano | Male Pin |
| Lami - Kuoana | 0.100" (2.54mm) |
| Idadi ya Nafasi | 12 |
| Idadi ya Safu | 1 |
| Nafasi ya Mstari - Kuoana | - |
| Idadi ya Nafasi zilizopakiwa | All |
| Mtindo | Board to Board or Cable |
| Kufunika | Unshrouded |
| Aina ya Kuweka | Surface Mount |
| Kukomesha | Solder |
| Aina ya Kufunga | Push-Pull |
| Urefu wa Mawasiliano - Kuoana | 0.230" (5.84mm) |
| Urefu wa Mawasiliano - Chapisha | - |
| Urefu wa Mawasiliano ya Jumla | - |
| Urefu wa Insulation | 0.090" (2.29mm) |
| Wasiliana na Sura | Square |
| Wasiliana Kumaliza - Kuchumbiana | Tin-Lead |
| Wasiliana Kumaliza Unene - Kupandana | 100.0µin (2.54µm) |
| Wasiliana kumaliza - Tuma | Tin-Lead |
| Nyenzo ya Mawasiliano | Copper Alloy |
| Nyenzo ya kuhami | Liquid Crystal Polymer (LCP) |
| Vipengele | Pick and Place |
| Joto la Uendeshaji | - |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | - |
| Rangi ya Insulation | Black |
| Ukadiriaji wa sasa | - |
| Ukadiriaji wa Voltage | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
