| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Receptacle |
| Aina ya Mawasiliano | Outer Shroud Contact |
| Mtindo | Board to Cable/Wire |
| Idadi ya Nafasi | 2 |
| Idadi ya Nafasi zilizopakiwa | All |
| Lami - Kuoana | 0.031" (0.80mm) |
| Idadi ya Safu | 1 |
| Nafasi ya Mstari - Kuoana | - |
| Aina ya Kuweka | Surface Mount |
| Kukomesha | Solder |
| Aina ya Kufunga | Detent Lock |
| Wasiliana Kumaliza - Kuchumbiana | Gold |
| Wasiliana Kumaliza Unene - Kupandana | 12.0µin (0.30µm) |
| Rangi ya Insulation | - |
| Urefu wa Insulation | 0.055" (1.40mm) |
| Urefu wa Mawasiliano - Chapisha | - |
| Joto la Uendeshaji | - |
| Ukadiriaji wa kuwaka kwa nyenzo | - |
| Wasiliana kumaliza - Tuma | Gold |
| Urefu wa Kupandana kwa Mated | 1.4mm |
| Ulinzi wa Ingress | - |
| Vipengele | Pick and Place, Solder Retention |
| Ukadiriaji wa sasa | 1A |
| Ukadiriaji wa Voltage | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
