| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | LGA |
| Idadi ya Vyeo au Pini (Gridi) | 2011 (47 x 58) |
| Lami - Kuoana | - |
| Wasiliana Kumaliza - Kuchumbiana | Gold |
| Wasiliana Kumaliza Unene - Kupandana | 15.0µin (0.38µm) |
| Nyenzo ya Mawasiliano - Kuchumbiana | Copper Alloy |
| Aina ya Kuweka | Surface Mount |
| Vipengele | Open Frame |
| Kukomesha | Solder |
| Panda - Chapisha | - |
| Wasiliana kumaliza - Tuma | Gold |
| Wasiliana Kumaliza Unene - Tuma | 15.0µin (0.38µm) |
| Nyenzo ya Mawasiliano - Chapisha | Copper Alloy |
| Nyenzo ya Nyumba | Thermoplastic |
| Joto la Uendeshaji | -25°C ~ 100°C |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
