| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kituo | Through Board |
| Kipenyo cha Shimo | 0.008" ~ 0.022" (0.20mm ~ 0.56mm) |
| Kipenyo cha Insulation | 0.063" ~ 0.094" (1.60mm ~ 2.39mm) |
| Urefu - Kwa ujumla | 0.413" (10.49mm) |
| Kupima waya | 20-24 AWG |
| Nyenzo ya Mawasiliano | Brass |
| Wasiliana kumaliza | Tin |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
