| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kituo | Through Board |
| Kipenyo cha Shimo | 0.047" (1.19mm) |
| Kipenyo cha Insulation | 0.026" ~ 0.048" (0.66mm ~ 1.22mm) |
| Urefu - Kwa ujumla | 0.413" (10.49mm) |
| Kupima waya | 26-30 AWG |
| Nyenzo ya Mawasiliano | Brass |
| Wasiliana kumaliza | Tin |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
