| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kituo | Wire to Board |
| Kipenyo cha Shimo | 0.058" ~ 0.062" (1.47mm ~ 1.57mm) |
| Kipenyo cha Insulation | - |
| Urefu - Kwa ujumla | 0.358" (9.09mm) |
| Kupima waya | - |
| Nyenzo ya Mawasiliano | Copper |
| Wasiliana kumaliza | Tin |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
