| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kituo | Wire to Board |
| Kipenyo cha Shimo | - |
| Kipenyo cha Insulation | 0.071" ~ 0.083" (1.80mm ~ 2.11mm) |
| Urefu - Kwa ujumla | 0.325" (8.26mm) |
| Kupima waya | 18-20 AWG |
| Nyenzo ya Mawasiliano | Brass |
| Wasiliana kumaliza | Tin |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
