| Andika | Maelezo. |
| Hali ya Sehemu | Obsolete |
|---|---|
| Aina ya Kituo | Wire to Board |
| Kipenyo cha Shimo | 0.047" ~ 0.063" (1.19mm ~ 1.60mm) |
| Kipenyo cha Insulation | 0.043" ~ 0.055" (1.10mm ~ 1.40mm) |
| Urefu - Kwa ujumla | 0.335" (8.50mm) |
| Kupima waya | 26-30 AWG |
| Nyenzo ya Mawasiliano | Brass |
| Wasiliana kumaliza | Tin |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
