| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Mtindo wa Kiunganishi | Receptacle |
| Aina ya Kiunganishi | Nano-Pitch I/O |
| Idadi ya Nafasi | 80 |
| Aina ya Kuweka | Surface Mount, Right Angle; Through Hole |
| Kukomesha | Solder |
| Vipengele | Board Guide |
| Wasiliana kumaliza | Gold |
| Wasiliana Kumaliza Unene | 30.0µin (0.76µm) |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
