Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Andika | DIP, 0.3" (7.62mm) Row Spacing |
Idadi ya Vyeo au Pini (Gridi) | 8 (2 x 4) |
Lami - Kuoana | 0.100" (2.54mm) |
Wasiliana Kumaliza - Kuchumbiana | Tin |
Wasiliana Kumaliza Unene - Kupandana | 200.0µin (5.08µm) |
Nyenzo ya Mawasiliano - Kuchumbiana | Beryllium Copper |
Aina ya Kuweka | Surface Mount |
Vipengele | Open Frame |
Kukomesha | Solder |
Panda - Chapisha | 0.100" (2.54mm) |
Wasiliana kumaliza - Tuma | Tin |
Wasiliana Kumaliza Unene - Tuma | 200.0µin (5.08µm) |
Nyenzo ya Mawasiliano - Chapisha | Brass |
Nyenzo ya Nyumba | Thermoplastic, Polyester |
Joto la Uendeshaji | -55°C ~ 125°C |
Hali ya RoHS. | Rohs inakubaliana. |
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Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |