| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Solder Paste |
| Muundo | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 |
| Kipenyo | - |
| Kiwango cha kuyeyuka | 409 ~ 424°F (209 ~ 218°C) |
| Aina ya Flux | No-Clean |
| Kupima waya | - |
| Mchakato | Lead Free |
| Fomu | Jar, 17.64 oz (500g) |
| Maisha ya rafu | 6 Months |
| Anza maisha ya rafu | Date of Manufacture |
| Uhifadhi / Jokofu Joto | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
