| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kituo | Through Board |
| Kipenyo cha Shimo | - |
| Kipenyo cha Insulation | 0.171" ~ 0.252" (4.35mm ~ 6.40mm) |
| Urefu - Kwa ujumla | 0.423" (10.74mm) |
| Kupima waya | 10-12 AWG |
| Nyenzo ya Mawasiliano | Copper Alloy |
| Wasiliana kumaliza | Tin |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
