| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header |
| Aina ya Mawasiliano | Male Pin |
| Lami - Kuoana | 0.100" (2.54mm) |
| Idadi ya Nafasi | 210 |
| Idadi ya Safu | 3 |
| Nafasi ya Mstari - Kuoana | 0.100" (2.54mm) |
| Idadi ya Nafasi zilizopakiwa | 207 |
| Mtindo | Board to Cable/Wire |
| Kufunika | Shrouded - 4 Wall |
| Aina ya Kuweka | Board Edge, Through Hole, Right Angle |
| Kukomesha | Solder |
| Aina ya Kufunga | Push-Pull |
| Urefu wa Mawasiliano - Kuoana | 0.210" (5.33mm) |
| Urefu wa Mawasiliano - Chapisha | 0.140" (3.56mm) |
| Urefu wa Mawasiliano ya Jumla | - |
| Urefu wa Insulation | - |
| Wasiliana na Sura | Square |
| Wasiliana Kumaliza - Kuchumbiana | Gold |
| Wasiliana Kumaliza Unene - Kupandana | 50.0µin (1.27µm) |
| Wasiliana kumaliza - Tuma | Tin-Lead |
| Nyenzo ya Mawasiliano | Brass |
| Nyenzo ya kuhami | Polyphenylene Sulfide (PPS) |
| Vipengele | Mating Guide, Mounting Flange |
| Joto la Uendeshaji | - |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | - |
| Rangi ya Insulation | - |
| Ukadiriaji wa sasa | - |
| Ukadiriaji wa Voltage | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
