| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header |
| Aina ya Mawasiliano | Male Pin |
| Lami - Kuoana | 0.049" (1.25mm) |
| Idadi ya Nafasi | 3 |
| Idadi ya Safu | 1 |
| Nafasi ya Mstari - Kuoana | - |
| Idadi ya Nafasi zilizopakiwa | All |
| Mtindo | Board to Cable/Wire |
| Kufunika | Shrouded - 3 Wall |
| Aina ya Kuweka | Surface Mount |
| Kukomesha | Solder |
| Aina ya Kufunga | - |
| Urefu wa Mawasiliano - Kuoana | 0.089" (2.25mm) |
| Urefu wa Mawasiliano - Chapisha | - |
| Urefu wa Mawasiliano ya Jumla | - |
| Urefu wa Insulation | 0.187" (4.75mm) |
| Wasiliana na Sura | Square |
| Wasiliana Kumaliza - Kuchumbiana | Tin |
| Wasiliana Kumaliza Unene - Kupandana | 120.0µin (3.05µm) |
| Wasiliana kumaliza - Tuma | Tin |
| Nyenzo ya Mawasiliano | Phosphor Bronze |
| Nyenzo ya kuhami | Liquid Crystal Polymer (LCP), Glass Filled |
| Vipengele | Solder Retention |
| Joto la Uendeshaji | -25°C ~ 85°C |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | - |
| Rangi ya Insulation | Natural |
| Ukadiriaji wa sasa | 1A |
| Ukadiriaji wa Voltage | 100VAC |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
