| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | SOIC |
| Idadi ya Vyeo au Pini (Gridi) | 20 (2 x 10) |
| Lami - Kuoana | - |
| Wasiliana Kumaliza - Kuchumbiana | Gold |
| Wasiliana Kumaliza Unene - Kupandana | - |
| Nyenzo ya Mawasiliano - Kuchumbiana | Beryllium Copper |
| Aina ya Kuweka | Through Hole |
| Vipengele | Closed Frame |
| Kukomesha | Solder |
| Panda - Chapisha | - |
| Wasiliana kumaliza - Tuma | Gold |
| Wasiliana Kumaliza Unene - Tuma | 30.0µin (0.76µm) |
| Nyenzo ya Mawasiliano - Chapisha | Beryllium Copper |
| Nyenzo ya Nyumba | Polyethersulfone (PES), Glass Filled |
| Joto la Uendeshaji | -55°C ~ 150°C |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
