| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Mtindo | Board to Card Edge |
| Aina ya Kiunganishi | Receptacle |
| Idadi ya Nafasi | 2 |
| Aina ya Kuweka | Surface Mount, Bottom Entry, Through Board |
| Kukomesha | Solder |
| Panda | 0.130" (3.30mm) |
| Aina ya Kufunga | - |
| Vipengele | 1.00mm Thick PCB, Solder Retention |
| Rangi ya Makazi | Natural |
| Kupima waya | - |
| Nyenzo ya Mawasiliano | Copper Alloy |
| Wasiliana kumaliza | Tin |
| Nyenzo ya Nyumba | Thermoplastic |
| Joto la Uendeshaji | -20°C ~ 130°C |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
