Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Andika | Wire Solder |
Muundo | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Kipenyo | 0.015" (0.38mm) |
Kiwango cha kuyeyuka | 423 ~ 424°F (217 ~ 218°C) |
Aina ya Flux | Rosin Activated (RA) |
Kupima waya | 27 AWG, 28 SWG |
Mchakato | Lead Free |
Fomu | Spool, 1 lb (454 g) |
Maisha ya rafu | - |
Anza maisha ya rafu | - |
Uhifadhi / Jokofu Joto | 50°F ~ 104°F (10°C ~ 40°C) |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |