| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Lapping Film |
| Nyenzo ya Abrasive | Diamond |
| Daraja la Abrasive | - |
| Grit iliyokasirika | - |
| Ukubwa wa Micron | 0.25µ |
| Rangi | - |
| Upana | 8.00" (203.20mm) |
| Urefu | 16.00" (406.40mm) |
| Kipenyo | - |
| Maombi | Fiber Optic Connector Polishing |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
