| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kituo | Through Board, Locking |
| Kipenyo cha Shimo | - |
| Kipenyo cha Insulation | 0.083" ~ 0.091" (2.11mm ~ 2.30mm) |
| Urefu - Kwa ujumla | 0.693" (17.60mm) |
| Kupima waya | - |
| Nyenzo ya Mawasiliano | Brass |
| Wasiliana kumaliza | Tin |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
