| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Mkia | Solder Cup |
| Kukomesha | Press-Fit |
| Urefu - Kwa ujumla | 0.290" (7.37mm) |
| Inakubali Kipenyo cha Pin | 0.015" ~ 0.025" (0.38mm ~ 0.64mm) |
| Inakubali Ukubwa wa Pini ya Mraba | - |
| Siri Kipenyo cha Shimo | 0.043" (1.09mm) |
| Kuweka kipenyo cha Hole | 0.057" (1.45mm) |
| Kipenyo cha Flange | 0.072" (1.83mm) |
| Kipenyo cha Mkia | - |
| Kina cha Tundu | 0.150" (3.81mm) |
| Nyenzo ya Mawasiliano | Beryllium Copper |
| Wasiliana kumaliza | Gold |
| Wasiliana Kumaliza Unene | 10.0µin (0.25µm) |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
