| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Shield Finger |
| Sura | - |
| Upana | 0.079" (2.00mm) |
| Urefu | 0.177" (4.50mm) |
| Urefu | 0.276" (7.00mm) |
| Nyenzo | Beryllium Copper |
| Mchovyo | Gold |
| Kupaka - Unene | Flash |
| Njia ya Kiambatisho | Solder |
| Joto la Uendeshaji | -40°C ~ 100°C |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
