| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kituo | Through Board, Locking |
| Kipenyo cha Shimo | 0.072" ~ 0.077" (1.83mm ~ 1.96mm) |
| Kipenyo cha Insulation | 0.060" ~ 0.110" (1.52mm ~ 2.79mm) |
| Urefu - Kwa ujumla | 0.250" (6.35mm) |
| Kupima waya | 18-22 AWG |
| Nyenzo ya Mawasiliano | Phosphor Bronze |
| Wasiliana kumaliza | Tin-Lead |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
