| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Lapping Film |
| Nyenzo ya Abrasive | Silicon Dioxide |
| Daraja la Abrasive | - |
| Grit iliyokasirika | - |
| Ukubwa wa Micron | - |
| Rangi | - |
| Upana | 6.00" (152.40mm) |
| Urefu | 6.00" (152.40mm) |
| Kipenyo | - |
| Maombi | Fiber Optic Connector Polishing |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
