Andika | Maelezo. |
Hali ya Sehemu | Obsolete |
---|---|
Andika | PGA, ZIF (ZIP) |
Idadi ya Vyeo au Pini (Gridi) | 370 (19 x 19) |
Lami - Kuoana | 0.100" (2.54mm) |
Wasiliana Kumaliza - Kuchumbiana | Gold |
Wasiliana Kumaliza Unene - Kupandana | 15.0µin (0.38µm) |
Nyenzo ya Mawasiliano - Kuchumbiana | Copper Alloy |
Aina ya Kuweka | Through Hole |
Vipengele | Open Frame |
Kukomesha | Solder |
Panda - Chapisha | 0.100" (2.54mm) |
Wasiliana kumaliza - Tuma | Gold |
Wasiliana Kumaliza Unene - Tuma | 15.0µin (0.38µm) |
Nyenzo ya Mawasiliano - Chapisha | Copper Alloy |
Nyenzo ya Nyumba | Liquid Crystal Polymer (LCP) |
Joto la Uendeshaji | - |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |