| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Mtindo wa Kiunganishi | Outer Shroud Contacts |
| Aina ya Kiunganishi | Receptacle |
| Idadi ya Nafasi | 68 |
| Idadi ya Safu | 2 |
| Aina ya Kuweka | Through Hole |
| Kukomesha | Solder |
| Makala ya Flange | - |
| Andika | Board to Board, High Density |
| Vipengele | Board Lock |
| Wasiliana kumaliza | Gold |
| Wasiliana Kumaliza Unene | 8.00µin (0.203µm) |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
