| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Receptacle |
| Aina ya Mawasiliano | Female Socket |
| Mtindo | Board to Board |
| Idadi ya Nafasi | 100 |
| Idadi ya Nafasi zilizopakiwa | All |
| Lami - Kuoana | 0.050" (1.27mm) |
| Idadi ya Safu | 2 |
| Nafasi ya Mstari - Kuoana | 0.100" (2.54mm) |
| Aina ya Kuweka | Through Hole |
| Kukomesha | Solder |
| Aina ya Kufunga | Push-Pull |
| Wasiliana Kumaliza - Kuchumbiana | Gold |
| Wasiliana Kumaliza Unene - Kupandana | 30.0µin (0.76µm) |
| Rangi ya Insulation | Natural |
| Urefu wa Insulation | 0.320" (8.13mm) |
| Urefu wa Mawasiliano - Chapisha | 0.095" (2.41mm) |
| Joto la Uendeshaji | -65°C ~ 125°C |
| Ukadiriaji wa kuwaka kwa nyenzo | - |
| Wasiliana kumaliza - Tuma | Tin-Lead |
| Urefu wa Kupandana kwa Mated | 10.92mm, 17.78mm, 18.75mm |
| Ulinzi wa Ingress | - |
| Vipengele | Board Guide, Ground Bus (Plane) |
| Ukadiriaji wa sasa | - |
| Ukadiriaji wa Voltage | 30VAC |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
